Operation process and operation requirements:
One, brown peel strength test:
1.1 Test Purpose: Determine the peel strength of brown
1.2 Instrument supplies: 1OZ copper foil, substrate, tensile testing machine, blade
1.3 Test methods:
1.3.1 Take an appropriate area of substrate and etch away the copper foil on both sides.
1.3.2 Take a piece of 1OZ copper foil of considerable size and fix it on the substrate.
1.3.3 The above sample is processed by the browning and pressing process. When the laminated PP is pressed together, the browning surface of the copper foil is in contact with the PP.
1.3.4 After shearing, cut a suitable sample and use a blade to cut the surface of the copper foil into two parallel lines, approximately 10cm long and 3.8mm wide.
1.3.5 Test the peel strength of copper foil according to the specification of tensile tester.
1.5 sampling methods and frequency: take the test plate 1PCS/line/week
Second, slice test:
2.1 Test purposes: Pressing a dielectric layer thickness;
Drilling a test hole wall roughness;
Plating a precise grasp of copper plating thickness;
Solder protection - green oil thickness;
2.2 Instrument supplies: sandpaper, grinding machine, metallographic microscope, polishing solution, microetching solution
2.3 Test method: 2.3 Test method:
2.3.1 Select specimens punch out the slice in place with a punch press.
2.3.2 The slice is fixed vertically in the model.
2.3.3 Reconcile resin and hardener in proportion and pour into the model to make it harden naturally.
2.3.4 Grinding to the center of the hole with a sandpaper in order from a small mesh to a large mesh
2.3.5 Polish with polishing liquid.
2.3.6 Micro-etched copper surface.
2.3.7 Observe and record it with a metallographic microscope.
2.4 sampling methods and frequency:
Plating - First piece, 1 PNL/per cylinder/shift, 2PNL per batch, 9 points when measuring hole copper, and 9 points for C/S surface when measuring surface copper.
Drilling - first piece, (1PNL/axis/4 machine/shift, take the floor of the drilling plate) The slice position of the plate edge, read the maximum hole wall roughness value.
Compression - first piece, (1PNL per part number and test plate thickness is not qualified) take the plywood edge anywhere.
(Note: The thickness of the laminated dielectric layer is less than or equal to 1mil than the required value for acceptance.)
Weldproof - first piece, (1PNL / 4 hours) take a separate line.
Third, the solder wire / resistance value test:
3.1 Test purposes: To predict the quality of the product after soldering and the resistance value at the supplementary line.
3.2 Instrument supplies: oven, solder pot, stopwatch, flux, metallographic microscope, ohmmeter, repair knife.
3.3 Test method:
3.3.1 Select the sample into the oven and bake at 150°C for 1 hour. Wear a roving glove during the operation and use a long handled clamp to take the sample.
3.3.2 Remove the sample and allow it to cool to room temperature.
3.3.3 Coat the flux evenly for 5 to 10 seconds to allow the excess flux to drip back.
3.3.4 Thoroughly immersed tin bath in 288 °C ± 5 °C tin furnace 10 ± 1 seconds / time, 3 times (fill the line must be completely immersed), after each dipping tin cooling and then re-immersion.
3.3.5 After the test, clean the sample and check for any fall off of the fill line.
3.3.6 If it is not possible to identify the slice at the time of filling, check the metallographic microscope for any abnormality at the line.
3.4 Resistance Test Method:
3.4.1 After repairing, remove the coverings (solder-proof paint and copper surface oxide layer) at both ends of the supplementary line with a repair knife, and do not injure the copper surface.
3.4.2 Use an ohmmeter to measure the resistance at both ends of the line.
3.4.3 Sampling method and frequency: Take 1PCS/week/per complement operator of finished board and semi-finished board
Four, green oil dissolution test:
4.1 Test Purpose: Test whether the solder mask on the surface of the specimen has been hardened and sufficient to handle the heat generated during soldering.
4.2 Instrument supplies: Chloroform, stopwatch, rag
4.3 Test Methods:
4.3.1 Drop a few drops of trichloromethane onto the solder mask surface of the sample and wait approximately one minute.
4.3.2 Use a rag to wipe off the trichloromethane solution. The cloth should be free of the color of the solder mask.
4.3.3 Then use a fingernail to scrape at the same position. If the solder mask is not scratched, it means the test is acceptable.
4.4 sampling methods and frequency: 3pcs/each batch before shipment
Fifth, acid and alkali resistance test:
5.1 Test Purpose: To evaluate the acid resistance of green oil.
5.2 Instrument Supplies: H2SO4 10%
5.3 Test Method:
5.3.1 Prepare an appropriate amount of 10% H2SO4.
5.3.2 Prepare an appropriate amount of NaOH at a concentration of 10%.
5.3.3 Place the sample in an oven and heat to about 120±5°C for 1 hour.
5.3.4 Soak the two groups of samples in each solution for 30 minutes.
5.3.5 Remove the sample and wipe it dry. Use 600#3M tape to cover the length of the paint surface approximately 2 inches long. Wipe the plastic surface 3 times by hand to ensure that the tape can only be used once at a time.
5.4 sampling methods and frequency: 3pcs/each batch before shipment.
Six, green oil hardness test:
6.1 Test Purpose: Test the hardness of green oil.
6.2 Instrument supplies: standard hardness pencil: 6H model pencil
6.3 Test Method:
6.3.1 Sharpen the pencil with a sharpener and sharpen it with fine sandpaper.
6.3.2 Place the sample horizontally on the work surface. First apply a 6H pencil to the surface of the sample with a general force, and then tilt it 45 degrees. Then push the pencil toward the sample so that the nib will slide about 1/4" long on the surface of the solder mask. .
6.3.3 If the solder mask is not scratched or damaged, the hardness of the sample is >6H.
6.3.4 If the solder mask has been scratched, the hardness is <6H.
6.4 sampling methods and frequency: 3pcs/each batch before shipment
Seven, green oil adhesion test:
7.1 Test Purpose: Test the adhesion of the solder mask and the board or circuit surface.
7.2 Instrument supplies: 600#3M tape
7.3 Test Method:
7.3.1 Before testing, check that the surface of the sample must be clean from dust or oil.
7.3.2 Use 600# 3M adhesive tape to cover the length of the paint surface approximately 2 inches long. Wipe the plastic surface 3 times by hand to ensure flattening. The tape can only be used once at a time.
7.3.3 Pull the vertical plate of the tape quickly by hand.
7.3.4 Check whether the tape is coated with a solder mask and whether the solder mask on the panel is loose or separated.
7.4 sampling methods and frequency: 3pcs/each batch before shipment
Eight, thermal stress test:
8.1 Test purpose: To predict the thermal stress tolerance of the product at the customer
8.2 Instrument supplies: oven, solder pot, stopwatch, flux, metallographic microscope.
8.3 Test Method:
8.3.1 Select the appropriate sample on the surface without any stratification, blistering, textured pattern, and the BGA and CPU are not painted with a whiteboard pen. Place in an oven and bake at 150°C for 4 hours.
8.3.2 Remove the specimen and allow it to cool to room temperature.
8.3.3 Adjust the tin furnace temperature to 288 °C, and insert a thermometer into the tin furnace to confirm the temperature of the tin furnace. If it does not meet the requirements, compensate until it meets the requirements. Then compensate until it meets the requirements.
8.3.4 Using a clamp to clamp the test plate, evenly apply the flux to the plate for 5 to 10 seconds to allow the excess flux to drip back. With drip back.
8.3.5 Thoroughly immersed tin bath in 288 °C ± 5 °C tin furnace 10 ± 1 seconds / time, remove the cooling and do a second time, a total of 3 times.
8.3.6 Remove the specimen and allow it to cool. Clean the specimen.
8.3.7 Make a well section (per the minimum pore size and PTH wells for section analysis).
8.3.8 Use a metallographic microscope to look at the slicing in the hole.
8.4 Precautions: Wear high-temperature gloves, sleeves and protective masks during operation, and use a long-handle clamp to take samples and test.
8.5 Sampling method and frequency: 3pcs/each batch before shipment
Nine, lead solder test:
9.1 Test Purposes: To predict the soldering condition of the product at the customer, use the Solder pot to simulate customer soldering conditions.
9.2 Instrument supplies: oven, lead tin furnace, stopwatch, lead flux, 10X magnifier
9.3 Test Method:
9.3.1 Select the appropriate sample, BGA and CPU have not been painted with a whiteboard pencil, and after confirming that the sample surface is clean, place in the oven and bake at 120°C for 1 hour.
9.3.2 After the sample is taken out, cool it down to room temperature.
9.3.3 Completely remove the scum and the coking flux residue from the tin-dissolved surface of the tin furnace.
9.3.4 Completely coat the sample with flux. The sample shall be allowed to drip for 5 to 10 seconds to allow the excess flux to drip back.
9.3.5 Carefully place the specimen on the surface of a tin bath at a temperature of 245°C for a period of 3 to 5 seconds.
9.4 Precautions: Wear high temperature resistant gloves, sleeves, and protective masks during operation. Use long-handle clamps to take samples and test.
9.5 Sampling method and frequency: 3pcs/per batch before shipment.
Ten, lead-free solder test:
10.1 Purpose of the test: To predict the soldering condition of the product at the customer, use the Solder pot to simulate customer soldering conditions.
10.2 Instrument supplies: oven, lead-free tin furnace, stopwatch, lead-free flux, 10X magnifying glass
10.3 Test Method:
10.3.1 Select the appropriate sample. The BGA and CPU are not painted with a whiteboard pencil. After confirming that the sample surface is clean, put it into the oven and bake at 120°C for 1 hour.
10.3.2 Allow the sample to cool to room temperature after it is removed.
10.3.3 Completely remove the scum and the coked flux residue from the tin-dissolved surface of the tin furnace.
10.3.4 Completely coat the sample with flux. The sample shall be allowed to drip for 5 to 10 seconds to allow the excess flux to drip back.
10.3.5 Carefully place the specimen on the surface of a tin bath at a temperature of 260°C for a period of 3 to 5 seconds.
10.4 Precautions: Wear high-temperature resistant gloves, sleeves, and protective masks during operation, and use a long-handle clamp to take samples and test.
10.5 Sampling methods and frequency: 3pcs/per batch prior to shipment.
Eleven, ion pollution degree test:
11.1 Test Purpose: To test the degree of ion contamination of the PCB after spraying tin, browning and molding.
11.2 Instrument supplies: ion contamination machine, isopropyl alcohol concentration 75 ± 3%
11.3 Test method: Test according to the ion contamination machine operation specification.
11.4 Precautions: Wear gloves and do not contaminate the board.
11.5 Sampling Method and Frequency: Take Tin Plates/Class
Tale brownboard once/shift
Take molding plate once/shift
Twelve, impedance test:
12.1 Test Purpose: Measure impedance to meet requirements
12.2 Instrument Supplies: Impedance Testers
12.3 Test Method: Test according to impedance tester operation specification
12.4 Sampling Method and Frequency: Impedance Requirements: Dry Film Etching 1 PNL per sheet per line, 1 PNL per line, Autonomous 2 PNL per batch, 3PNL for each shift
(Note: The standard value of impedance after welding is the same as the standard value of finished product)
Thirteen, Tg test:
13.1 Test purpose: Test whether the Tg of the laminated plate meets the requirements.
13.2 Instrument supplies: Tg tester.
13.3 Test Method: Test according to the Tg Tester operating specification.
13.4 sampling methods and frequency: Take 1PCS/week of finished board.
XIV. Tin-lead component test:
14.1 Test Purpose: Test to check whether the tin-lead component is within the acceptable range.
14.2 Instrument supplies: Spectrovac 2000OR direct emission spectroscopy.
14.3 Test Method: Outgoing test.
14.4 Sampling Method and Frequency: Take tin-like samples/week for each line of spray.
Fifteen, etch factor test:
15.1 Test Purpose: Test to check the etching condition of the etching line.
15.2 Instrument Supplies: Sandpaper, Grinding Machine, Metallurgical Microscope, Polishing Fluid, Micro Etching Fluid
15.3 Test method: Etch according to normal parameters, and then do a slice analysis of the etch factor calculation formula: EF=2T/(b-a)
15.4 Sampling Method and Frequency: Take the normal mass production board of outer etching line, 1PCS/each line/month.
XVI. Chemical gold, text adhesion test:
16.1 Test Purpose: Test to check the adhesion of the post-chemical gold deposit.
16.2 Instrument Supplies: 3M#600 Tape
16.3 test Method:
16.3.1 Place the test board on the table
16.3.2 Use 600#3M adhesive tape to cover the length of the paint surface approximately 2 inches long. Wipe the plastic surface 3 times by hand to ensure flattening. The tape can only be used once at a time.
16.3.3 Pull the vertical plate of the tape quickly by hand.
16.3.4 Observe whether there is any stain on the tape, such as gold or text paint, and if there is any phenomenon of loosening or separation on the surface of the gold/text.
16.3.5 Sampling Method and Frequency: 3pcs/ Before Shipment
Seventeen, hole pull test:
17.1 Test Purpose: Test the tensile strength of copper plating
17.2 Instrument Supplies: Electric Iron, Tensile Tester, Copper Wire
17.3 Test Method:
17.3.1 Insert the copper wire directly into the hole and solder it with soldering iron;
17.3.2 The hole to be tested must have a complete PAD surface, and the excess lines must be removed on the PAD side.
17.3.3 The end of the copper wire is clamped with a pulling machine and pulled up by a pulling machine until the copper wire is broken or the hole is pulled out. The reading C (Kg) is calculated.
17.3.4 Measure the inner diameter of the hole C2 (mm) and the outer diameter of the hole ring C1 (mm) with a vernier caliper.
17.3.5 Calculating hole pull strength: ib/in2
F = 4C/ (C12 - C22)*1420
F: Pull strength
C1: Outer Diameter of Hole (mm)
C2: bore ring inner diameter (mm)
17.3.6 Sampling Method and Frequency: Take Outer Etched Plate 1PCS/Week
Eighth, line pull test:
18.1 Test Purposes: Test the adhesion of the coating to the PP.
18.2 Instrument supplies: tensile testing machine, blade, vernier caliper.
18.3 Test Method:
18.3.1 Measure the line width (mm) with a vernier caliper.
18.3.2 Prompt the tip of the wire with a blade and strip approximately 2 cm. Clamp the tip of the wire with the tensile tester chuck.
18.3.3 Peel off the line by ascending (pulling speed: 50mm/min) to calculate the pulldown reading (Kg).
18.3.4 Line Tension Calculation:
Tensile force (kg) Unit: ib/in
Line width (mm) Unit: ib/in
18.4 Sampling Method and Frequency: Take the outer etching plate 1PCS/week.
Nineteenth, high voltage insulation test:
19.1 Test Purpose: Test Insulation of Board Materials
19.2 Instrument supplies: high voltage insulation tester, oven 19.2 Instrument supplies: high voltage insulation tester, oven
19.3 Test Method:
19.3.1 baking board, the temperature is 50-60 °C / 3 hours, cooled to room temperature, select the sample on the nearest and not conductive to each other a pair of lines.
19.3.2 According to the operating specification of the high voltage insulation tester, the test requirements are as follows:
a) Line spacing < 3mil, required voltage 250V, current 0.5A.
b) Line spacing ≧ 3mil, voltage required 500V, current 0.5A.
c) Voltage and current can be set according to customer requirements.
d) Or press the dual panel with 1000V and the multilayer board with 500V.
19.3.3 Maintain power for 30+3/-0 seconds. If there is a breakdown during this period, the sample is not qualified.
19.3.4 Before the test, the test bench must be cleaned, and there must be no metal objects, so as not to affect the test results or electric shock.
19.4 Precautions: Wear high pressure gloves when handling
19.5 Sampling Method and Frequency: Take 1PCS/Period of Product Board.
20. Spray tin (gold-plated, gold, silver) thickness test:
Test purpose: to test whether the thickness of the spray tin (chemical gold and silver) is within the qualified range.
20.2 instruments: X-ray tester.
20.3 test method: test according to the operation specification of X-ray tester.
20.4 sampling method and frequency: first piece, 1pcs/ batch
21. Exception management and troubleshooting:
1, finished product reliability experiment found that 1 PCS is not eligible, should be immediately reported to qa supervisor, and get the same material number plate of the same cycle redo the same reliability experiment (more than the number 10 PCS), if there is 1 PCS in the second test plate test unqualified redo the same reliability experiment (more than the number 10 PCS), if there is 1 PCS in the second test plate test unqualified in consultation with the subsequent heavy industry and heavy inspection measures.
2, the process of test 1 PCS is not eligible, should be immediately reported to qa supervisor and inform the responsible unit director, and the same material number plate redo the same cycle test (quantity more than 5 PCS), a second experiment 1 PCS board test is not qualified to open the CAR to the responsible units, tracking to improve sample confirmed effect after, if still bad can be discontinued or reporting to qa supervisor and responsibility unit director in consultation with countermeasures.
Inspection of welding quality:
1.Direct visual inspection, then 1.5 to 10 times magnifying glass.
2.Confidentiality (tape test) : use 3M tape to test the tensile strength of the film according to the provisions of TM22.214.171.124 in IPC-TM-650.
3.Hardness test: in accordance with IPC - 3.5.1 track of SM - 840 - c/TM 126.96.36.199 standard hardness tests, with a piece of after after baking board, pencil hardness tester (JIS specification) about 45 ℃ a Newton's force Angle on the board face painting a treaty, an inch long line, with rubber erase carbon powder and to check whether there is scratch on the plate, the scratch is not dew copper shall prevail.
4.Acid-proof alkaline test: in accordance with IPC - SM - 840 - c 188.8.131.52 standard, take 6 PNL, silver plates each 2 slices immersed in 10% HCl, 10% - H2SO4, 10% NaOH solution for 30 min; another 6 PNL the OSP test plate 2 slices immersed in 10% HCl, 10% - H2SO4, 10% NaOH solution after 60 min observe surface whether there is a blister, peel, color, etc happens, with 3 m tape stripping tests again
5.Solvent resistance: in accordance with ipc-sm-840c 184.108.40.206 standard, clean the coating surface, observe whether the surface has bubbling, peeling, discoloration, etc., and then use 3M tape for stripping test.
6.High temperature resistance:
1) weldability: according to ipc-sm-840c3.7, when welding according to j-std-003, it is necessary to check whether the weldability of welding joints has adverse effects.
2) solder resistance: according to IPC- sm-840c3.7.2, according to the specified conditions (j-std-004: M soldering liquid, j-std-006: Sn60 or Sn63 type solder), wuxi paste is applied to the coating.
3) heat resistance of solder: observe the appearance of coated film after soldering, check whether there is bubbling, and test whether there is any dissection or not.
4) resistance to spray tin: spray tin after treatment with soldering flux, check whether the film has bubbling, peeling, etc., and then apply the tape to pull the test and observe the appearance of the coating.
5) bleaching tin test: temperature: 260 ℃, time of 10 s, test three times;288 ℃, time of 10 s, test three times.After examination, whether the film has bubbling, peeling, etc.
7.Test the effect of plug hole: take the plate cut BGA bit and make a section to check the effect of plug hole.
8.The thickness of ink on the detection line: the silver and OSP plates are taken as sections, and the ink thickness of different positions on the line is measured.
9.In the case of lateral erosion: take the test board to make a number of sections and measure whether the depth of the item is within the specified range of 1.2mil.
10.Thermal shock: in accordance with IPC - SM - 840 - C 3.9.3 / TM220.127.116.11 H grade - 65 ~ 125 ° C, a 100 - cycle, procuratorial coating have bubbles, cracks, stripping, etc.
11.The properties of silver resistance, OSP, and plating/gold plating: after the different surface treatments of silver and OSP wires were taken from several test plates, it was observed that there were some bad conditions such as blister, peeling, arched or discoloration.(test conditions - plating (electrolysis) : 42 ° C, 1.0 A/dm squared, 5 minutes; gold (no electrolytic) : 90 ° C, 5 minutes.)